The potting of single components, printed circuit boards and whole modules with resin is not outsourced to an external company, but is performed in own-developed production processes with many years of experience at Karré. Whether for small quantities or large amounts – we provide individual solutions, which offer an optimal functionality for your various uses. Your advantage as a customer of Karré: A coordinated end-to-end solution from a single source.
Tailor-made potting-solutions for all demands
Specific protection by specified resins
- Mechanical protection against humidity, dirt, dust, water, corrosion, chemicals, temperature fluctuations etc.
- Protection against contact (electric safety)
- Electric isolation
- Explosion protection
- Fixation of components
- Increase of vibration and shock resistance
Wide diversity of experience in material selection
We own a potting-system of Vieweg, one of the leading specialists dosage dose and potting technology. There is a wide portfolio of potting compounds of renowned manufacturers. To choose an optimal potting compound for a special requirement mix, we work closely together with our suppliers as a well-integrated team for many years.
Quality assurance through standardized tests
The potting compound consists of two components, which harden after mixing and don’t produce any by-products. The relatively high density of the two-component potting compound allows the choice of smaller case sizes. Before the start of production we provide a potting sample from every production batch, where curing process is undergone physical and visual control.
Non-drip 3D-potting and bonding work
Depending on the nature of the task, the work will be done manually or with the help of an automatic potting-system. We fill the single sensing elements with potting compound, potting the printed circuit boards partially or completely and encapsulate modules completely. We can also perform a high-quality bonding work. Thus, for example, cases can be bonded in exact reproducible quality.